MLF QFN TEST SOCKET

High Frequency Testing (Ring Contact System)

• Surface pressure mount onto DUT Board
• Target Contact Force; 25~45gf
• Electrical Length (Compressed Height); 0.39mm(0.5mm pitch), 0.84mm(1.0mm pitch)
• Self Inductance: 0.03nH
• Insertion Loss; -1.5db@5Ghz (including Test board)
• Contact Resistance; Initial < 30 mOhms
• Current Carrying Capacity; <5 Amp @ Room Temp
• Pitch; >=0.5mm
• Material; BeCu
• Plating; Ni/Au
• Durability; Test Ongoing
• Operation Temp; <=150 degree C

• Clamshell Style Socket
• Socket with Double Latch Lid

Pogo pin Socket

• Surface pressure mount onto DUT Board
• Target Contact Force; 15gf per pin
• Tip Shape to Device; Crown for Ceramic Package, Corn for Plastic Package
• Tip Shape to DUT Board; Crown
• Electrical Length (Compressed Height); 6.1mm
• Contact Resistance; Initial < 30 mOhms
• Pitch; >=0.5mm
• Material; Plunger ;BeCu, Sleeve; Au Clad , Spring; Music wire or SUS wire
• Plating; Ni/Au
• Durability; 200,000 times
• Operation Temp; <=150 degree C

• Clamshell Style Socket
• Socket with Double Latch Lid

• Soldering into through holes of the DUT Board
• Target Contact Force; 15gf per pin
• Contact Resistance; Initial < 30 mOhms
• Pitch; >=0.5mm
• Material; BeCu
• Plating; Ni/Au
• Durability; 10,000 times
• Operation Temp; <=150 degree C

• All Tooled Clamshell Style Socket