MU contact system (high performance)

  • Minimum 0.4mm pitch
  • Maximized cross section (better signal flow)
  • Maximum 8Gbps or faster
  • All kind of devices to optimize tip geometry
  • -50~125(180 optional) C operation

UA contact system (low cost)

  • Maximized cross section (better signal flow)
  • Minimum 0.4mm pitch
  • Maximum 6Gbps
  • -50~125 C operation

CT contact system (conventional)

  • Minimum 0.4mm pitch
  • -50~125 C operation

FC contact system (wafer level)

  • Minimum 0.12mm pitch